[eagle] More Information

Dick Jansson-rr rjansson at cfl.rr.com
Sun Oct 21 11:11:14 PDT 2007


John:
 
This will be my concluding note on this subject prior to the Symposium. I
have tuned the analyses done yesterday and that data follows.
 
For a single 1.4mil ground plane with a single IC located 52mm from the
Baseplate edge, a 1.0W dissipation results in a temperature rise of 38.2°C
 
For a double 1.4mil ground plane with a single IC located 28mm from the
Baseplate edge, a 1.0W dissipation results in a temperature rise of 21.1°C.
 
For a double 1.4mil ground plane with TWO ICs, spaced 40mm and both located
28mm from the Baseplate edge, a 1.0W dissipation in each IC results in
temperature rises of 26.1°C (one at 26.0 and the other at 26.2). Total
dissipation here is 2.0W.
 
In other words, doubling the ICs, with this spacing, only added ~24% to the
temperature rise. This shows you how this module design handles the kind of
power situations that you have in the URx.
 
See you in Pittsburgh?
 
’73,
Dick Jansson, KD1K
 <mailto:kd1k at amsat.org> kd1k at amsat.org 
 <mailto:kd1k at arrl.net> kd1k at arrl.net 
 
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